High Thermal Conductivity AlN Aluminum Nitride Ceramic Substrate

Introduction to Aluminum Nitride Ceramic Substrates

Aluminum Nitride Ceramic Substrates are ceramic substrates made of Aluminum Nitride (AlN) material, manufactured by powder molding and high temperature sintering process. Aluminum nitride ceramic substrates are widely used in the field of heat dissipation and packaging of high power electronic devices and integrated circuits due to their excellent thermal conductivity, electrical insulation and mechanical properties.

Features of Aluminum Nitride Ceramic Substrates

High thermal conductivity: high thermal conductivity (about 170-200 W/m-K), can effectively conduct heat, suitable for heat dissipation of high power devices.

Excellent electrical insulation: high resistivity, suitable for use as an insulating substrate for electronic devices.

Low coefficient of thermal expansion: close to the coefficient of thermal expansion of semiconductor materials such as silicon, reducing thermal stress.

High mechanical strength: high hardness and flexural strength, able to withstand mechanical stress.

High temperature resistance: can work stably in high temperature environment, suitable for high temperature applications.

Chemical stability: exhibits good corrosion resistance to most chemicals.

Low dielectric constant and dielectric loss: suitable for high frequency electronics applications.

Specifications of Aluminum Nitride Ceramic Substrates

Property	Typical Specification
Material Composition	AlN (Aluminum Nitride)
Thermal Conductivity	170-220 W/m·K
Coefficient of Thermal Expansion	~4.5-5.0 ppm/°C (similar to silicon)
Dielectric Strength	>20 kV/mm
Dielectric Constant (1 MHz)	~8.4 – 9.6
Volume Resistivity	>10^14 Ω·cm at 25°C
Mechanical Strength (Bending)	~350-450 MPa
Hardness (Vickers)	~12-14 GPa
Density	~3.26 g/cm³
Porosity	<1%
Operating Temperature Range	-269°C to +1000°C
Chemical Stability	Excellent resistance to acids, alkalis, and molten metals
Surface Finish	Can be polished to optical quality or left with a machined finish
Dimensions	Customizable; typical thickness ranges from 0.5 mm to several millimeters, with various length and width options
Purity	High purity options available (e.g., >99%)
Thermal Shock Resistance	Good thermal shock resistance due to low CTE and high thermal conductivity
Outgassing Characteristics	Low outgassing, suitable for vacuum applications

Applications of Aluminum Nitride Ceramic Substrates

High power electronic devices: used as heat dissipation substrate for LED, laser diode, IGBT and other devices.

Integrated circuit packaging: used as packaging substrate for high-performance integrated circuits to improve heat dissipation efficiency.

Semiconductor manufacturing: Used for heaters and electrostatic suction cups for semiconductor equipment.

Communication equipment: Used as high frequency circuit substrates for 5G communication equipment.

Automotive electronics: Heat dissipation substrates for power modules in electric vehicles.

Aerospace: for heat dissipation and packaging of high-reliability electronic equipment.

New energy field: Heat dissipation substrates for solar inverters and wind power converters.

Company Profile

RBOSCHCO is a trusted global chemical material supplier & manufacturer with over 12 years experience in providing super high-quality chemicals and Nanomaterials.

The company has a professional technical department and Quality Supervision Department, a well-equipped laboratory, and equipped with advanced testing equipment and after-sales customer service center.

If you are looking for high-quality Aluminum Nitride Ceramic Substrates please feel free to contact us or click on the needed products to send an inquiry. 

Payment Term

T/T, Western Union, Paypal, Credit Card etc.

Packing and Storage

The product is in powder form and should be stored in a cool, ventilated place. Avoid inhalation when using it and keep away from open flames, heat sources, etc.

Shipment Term

By air, by sea, by express, as customers request.

FAQs of Aluminum Nitride Ceramic Substrates

Question 1: What is the main material of aluminum nitride ceramic substrate? What are its properties?

Answer: The main material of aluminum nitride ceramic substrate is aluminum nitride (AlN). It has high thermal conductivity (170-200 W/m-K), excellent electrical insulation, low coefficient of thermal expansion, high mechanical strength, high-temperature resistance and chemical stability.

Question 2: Why is the thermal conductivity of aluminum nitride ceramic substrates important?

Answer: High thermal conductivity enables Aluminum Nitride ceramic substrates to conduct heat quickly, effectively reduce the operating temperature of high-power

electronic devices, improve device performance and reliability, and is particularly suitable for the heat dissipation needs of LEDs, laser diodes and power modules.

Question 3: What is the application of AlN ceramic substrates in semiconductor manufacturing?

Answer: In semiconductor manufacturing, aluminum nitride ceramic substrates are used to make heaters and electrostatic suction cups, which provide stable heating and adsorption performance due to their high-temperature resistance, high thermal conductivity and electrical insulation.

Question 4: What are the advantages of aluminum nitride ceramic substrates over alumina substrates?

Answer: The advantages of aluminum nitride ceramic substrates include higher thermal conductivity, lower coefficient of thermal expansion, better high-frequency performance, higher mechanical strength, and better chemical stability at high temperatures. In summary, aluminum nitride ceramic substrates, with their excellent thermal management and electrical performance, have taken an important role in high-performance electronics, especially in applications that require efficient heat dissipation and a well-matched coefficient of thermal expansion.

Question 5: What is the application of Aluminum Nitride ceramic substrates in new energy vehicles?

Answer: In new energy vehicles, aluminum nitride ceramic substrates are used as heat dissipation substrates for power modules (e.g., IGBTs) in electric vehicles to ensure the stable operation of high-power devices in high-temperature environments, and to improve the performance and reliability of the entire vehicle.