Tungsten boride is a compound of tungsten and boron, and has a high strength and high temperature resistance. This material has applications in the fields of wear-resistant coating for wear parts and anti-friction materials. It is also used in semiconductor thin film.

These borides are available in powder and nanopowder forms. They are produced from a direct reaction between a metal tungsten and elemental boron. The boride is then sintered or thermally bonded to a substrate, such as aluminum, to improve toughness and bonding strength.

Boron is a much less expensive transition metal than tungsten, and this lowers the cost of manufacturing the material. Boron is used as a filler for various industrial and consumer products. In a variety of industries, such as aerospace, tungsten boride is a highly desired material.

Tungsten boride has a wide range of potential applications, including anti-friction materials, catalysts, and catalytic materials. It has high hardness, chemical stability, and melt point. Because of its versatility, tungsten boride has a wide range of uses. However, it has a number of limiting factors.

For instance, the boron content can vary significantly and there is a large degree of polysomatism. This leads to difficulties in obtaining single crystals.

Furthermore, the density of the borides is not uniform, resulting in significant variations in literature. This could mean that other borides are present in a given sample, which can have an impact on its properties.

As a result, the mechanical properties of tungsten boride are closely related to its purity. If the boron content is low, the density will be lower, making it ideal for lighter weight applications.

tags: semiconductor semiconductor material