Overview of Aluminum Nitride AlN Ceramic Microsphere
Aluminum Nitride (AlN) Ceramic Microsphere is a ceramic microsphere composed of aluminum and nitrogen elements, with excellent physical and chemical properties. AlN is an ionic covalent compound with high hardness, high melting point, and good chemical stability. As a ceramic microsphere, it has a high specific surface area, uniform particle size distribution, and excellent thermal stability. AlN ceramic microspheres have shown excellent performance in various application fields, such as being used as fillers to enhance the mechanical properties and thermal stability of composite materials, or as high-frequency and high-temperature electronic packaging materials in the electronics industry. In addition, AlN ceramic microspheres have also been applied in fields such as heat sinks and heat exchangers due to their high thermal conductivity. In summary, AlN ceramic microspheres are a high-performance multifunctional material that plays an important role in multiple fields.
Features of Aluminum Nitride AlN Ceramic Microsphere
High Thermal Conductivity: AlN ceramic microspheres exhibit excellent thermal conductivity, making them effective in heat dissipation and thermal management applications.
High Mechanical Strength: With its high hardness and stiffness, AlN ceramic microspheres offer superior mechanical strength and durability.
Good Chemical Stability: AlN ceramic microspheres are resistant to chemical corrosion and degradation, ensuring long-term stability in harsh environments.
Excellent Electrical Properties: AlN ceramic microspheres have high electrical resistivity and low dielectric loss, suitable for use in electronic packaging and high-frequency applications.
Uniform Particle Size Distribution: The microspheres offer a uniform particle size distribution, which ensures consistent performance in composites and fillers.
High Surface Area: The small size and spherical shape of AlN ceramic microspheres provide a large surface area, enhancing their interaction with other materials and improving composite properties.
Application of Aluminum Nitride AlN Ceramic Microsphere
Thermal Management: AlN ceramic microspheres are used in heat sinks, thermal barriers, and heat exchangers to enhance thermal conductivity and dissipate heat efficiently.
Electronic Packaging: Due to their high thermal conductivity and electrical properties, AlN ceramic microspheres are ideal for use in electronic packaging materials, improving component reliability and performance.
Composite Reinforcement: The microspheres can be added to polymer composites, metals, and ceramics to enhance mechanical properties such as stiffness and strength.
Ceramic Coatings and Films: AlN ceramic microspheres are used in ceramic coatings and films to improve wear resistance, corrosion resistance, and thermal stability.
Application of Aluminum Nitride AlN Ceramic Microsphere
Optical Applications: The high refractive index and transparency of AlN ceramic microspheres make them useful in optical applications such as lenses, filters, and waveguides.
Advanced Ceramics and Ceramic Matrix Composites: AlN ceramic microspheres are incorporated into advanced ceramics and ceramic matrix composites to improve their thermal, mechanical, and electrical properties for use in high-performance applications.
Application of Aluminum Nitride AlN Ceramic Microsphere
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Q1
What are the key physical properties of Aluminum Nitride (AlN) Ceramic Microsphere?
Answer: The key physical properties of AlN Ceramic Microsphere include its high thermal conductivity, mechanical strength, and chemical stability. These properties make it suitable for various applications such as thermal management, electronic packaging, and composite reinforcement.
Q2
How does the high thermal conductivity of Aluminum Nitride (AlN) Ceramic Microsphere benefit its applications?
Answer: The high thermal conductivity of AlN Ceramic Microsphere is beneficial in applications where efficient heat dissipation is crucial. It helps to rapidly transfer heat away from hotspots, preventing thermal runaway and enhancing the overall performance and reliability of devices.
Q3
In what types of composites can Aluminum Nitride (AlN) Ceramic Microsphere be used for reinforcement?
Answer: AlN Ceramic Microsphere can be used as a reinforcement material in various types of composites, including polymer composites, metal matrix composites, and ceramic matrix composites. It enhances the mechanical properties of the composites, such as stiffness and strength, while also improving thermal stability and resistance to corrosion.
Q4
Are there any limitations to the use of Aluminum Nitride (AlN) Ceramic Microsphere?
Answer: While Aluminum Nitride (AlN) Ceramic Microsphere offers many advantages, there are some limitations to its use. For example, it can be expensive to produce in large quantities due to the high cost of raw materials and processing techniques. Additionally, its high hardness and brittleness can make it challenging to machine or shape into complex geometries.
Q5
How does the uniform particle size distribution of Aluminum Nitride (AlN) Ceramic Microsphere affect its performance?
Answer: The uniform particle size distribution of AlN Ceramic Microsphere is crucial for its performance. It ensures consistent dispersion and interaction with the matrix material, leading to more uniform reinforcement and improved mechanical properties of the composite. This consistency also facilitates easier processing and handling of the material.
Aluminum Nitride Microsphere Properties | |
Other Names | Aluminium nitride |
CAS No. | 24304-00-5 |
Compound Formula | AlN |
Molecular Weight | 40.9882 |
Appearance | White to pale yellow powder |
Melting Point | 2200 °C |
Boiling Point | 2517 °C (dec.) |
Density | 2.9 to 3.3 g/cm3 |
Solubility in H2O | N/A |
Electrical Resistivity | 10 to 12 10x Ω-m |
Poisson's Ratio | 0.21 to 0.31 |
Specific Heat | 780 J/kg-K |
Thermal Conductivity | 80 to 200 W/m-K |
Thermal Expansion | 4.2 to 5.4 µm/m-K |
Young's Modulus | 330 GPa |
Exact Mass | 40.9846 |
Monoisotopic Mass | 40.9846 |
Remarks | Danger |
Hazard Statements | H314-H335 |
Hazard Codes | Xi |
Risk Codes | 36/37/38 |
Safety Statements | 26-37/39 |
RTECS Number | N/A |
Transport Information | N/A |
WGK Germany | 3 |